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Hardware Architectures for Post-Quantum Digital Signature Schemes - Ramesh Karri - Bog - Springer Nature Switzerland AG - Plusbog.dk

Electronic System-Level HW/SW Co-Design of Heterogeneous Multi-Processor Embedded Systems - Luigi Pomante - Bog - River Publishers - Plusbog.dk

Electronic System-Level HW/SW Co-Design of Heterogeneous Multi-Processor Embedded Systems - Luigi Pomante - Bog - River Publishers - Plusbog.dk

Modern electronic systems consist of a fairly heterogeneous set of components. Today, a single system can be constituted by a hardware platform, frequently composed of a mix of analog and digital components, and by several software application layers. The hardware can include several heterogeneous microprocessors (e.g. GPP, DSP, GPU, etc.), dedicated ICs (ASICs and/or FPGAs), memories, a set of local connections between the system components, and some interfaces between the system and the environment (sensors, actuators, etc.). Therefore, on the one hand, multi-processor embedded systems are capable of meeting the demand of processing power and flexibility of complex applications. On the other hand, such systems are very complex to design and optimize, so that the design methodology plays a major role in determining the success of the products. For these reasons, to cope with the increasing system complexity, the approaches typically used today are oriented towards co-design methodologies working at the higher levels of abstraction. Unfortunately, such methodologies are typically customized for the specific application, suffer of a lack of generality and still need a considerable effort when real-size project are envisioned. Therefore, there is still the need for a general methodology able to support the designer during the high-level steps of a co-design flow, enabling an effective design space exploration before tackling the low-level steps and thus committing to the final technology. This should prevent costly redesign loops.In such a context, the work described in this book, composed of two parts, aims at providing models, methodologies and tools to support each step of the co-design flow of embedded systems implemented by exploiting heterogeneous multi-processor architectures mapped on distributed systems, as well as fully integrated onto a single chip.

DKK 778.00
1

High Performance Computing for Big Data - - Bog - Taylor & Francis Inc - Plusbog.dk

High Performance Computing for Big Data - - Bog - Taylor & Francis Inc - Plusbog.dk

High-Performance Computing for Big Data: Methodologies and Applications explores emerging high-performance architectures for data-intensive applications, novel efficient analytical strategies to boost data processing, and cutting-edge applications in diverse fields, such as machine learning, life science, neural networks, and neuromorphic engineering. The book is organized into two main sections. The first section covers Big Data architectures, including cloud computing systems, and heterogeneous accelerators. It also covers emerging 3D IC design principles for memory architectures and devices. The second section of the book illustrates emerging and practical applications of Big Data across several domains, including bioinformatics, deep learning, and neuromorphic engineering. Features Covers a wide range of Big Data architectures, including distributed systems like Hadoop/Spark Includes accelerator-based approaches for big data applications such as GPU-based acceleration techniques, and hardware acceleration such as FPGA/CGRA/ASICs Presents emerging memory architectures and devices such as NVM, STT- RAM, 3D IC design principles Describes advanced algorithms for different big data application domains Illustrates novel analytics techniques for Big Data applications, scheduling, mapping, and partitioning methodologies Featuring contributions from leading experts, this book presents state-of-the-art research on the methodologies and applications of high-performance computing for big data applications. About the Editor Dr. Chao Wang is an Associate Professor in the School of Computer Science at the University of Science and Technology of China. He is the Associate Editor of ACM Transactions on Design Automations for Electronics Systems (TODAES), Applied Soft Computing, Microprocessors and Microsystems, IET Computers & Digital Techniques, and International Journal of Electronics. Dr. Chao Wang was the recipient of Youth Innovation Promotion Association, CAS, ACM China Rising Star Honorable Mention (2016), and best IP nomination of DATE 2015. He is now on the CCF Technical Committee on Computer Architecture, CCF Task Force on Formal Methods. He is a Senior Member of IEEE, Senior Member of CCF, and a Senior Member of ACM.

DKK 1042.00
1

Industry 4.0, China 2025, IoT - Wolfgang Babel - Bog - Springer - Plusbog.dk

Industry 4.0, China 2025, IoT - Wolfgang Babel - Bog - Springer - Plusbog.dk

The book gives an overview about automation technology over the last 50 years, based on my own experiences. It is a good summery for automation since 1970 for all who want to know about the context of automation developments and their standards. It is a fundamental summery and enables the reader to get experience in the complex field of automation. In detail the question is arised, whether Industry 4.0, China 2025, IoT, AI are a revolution or more an evolution of timewise established availbale technologies in HW, SW and algorithms. Is the hype about Industry 4.0 justified or not?In that context a timelline since 1970 ist shown for AI, ANN, essential milestones in automation, e.g OSI-model, automation pyramid, standards for bus systems, main SW-languages, robots, AI, ANN, pattern recognittion, Ethernet, the 12 most important international field busses, their main features and characterisitcs, foundation of committees, harmonization and standardization efforts, OPC UA and cloud computing, field devices, PLCs, SCADA, MES, ERP and automation history. All that history is seen in the context of µ-controller, DSP (Digital signal processor), FPGAs (Field Programmable Gate Arrays), ASICs (Application-Specific Integrated Circuit) , Chip on Board. It is include the HW-history, from Intel 8080 to octuple multicore processors. In the same way it is shown the history of field device out from laboratory into the field with all difficulties and benefits of that transition. The issues are summerized in a pyramid of complexity. Requirements for robustness and safety are shown for field devices. In the same way it is shown the development of mainframes, workstations and PC’s. SAP a leading ERP System is explained in mor detail. Specially it is figured out how SAP works and what has to be considered in working with such kind of system. The differences between MES- and ERP-systems are discussed, specially also for future combined SAP/MES systems. Explained are the problems of middlesized companies (SMEs) in dealing with Industry 4.0 and automation. Further examples are given and discussed for automized quality control in automotvie, PCB-handling, CIGS (Solar cell)-production. Also shown is the upgrade for older products and make them ready for automation standards. In detail the history oft he modern robotics is shown for the automotive industry. In summery also is figured out the Industry 5.0 which is just coming up more and more.

DKK 986.00
1