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Thermal Grizzly Putty Pro 30g - Pasta termoprzewodz?ca - Chlodzenie CPU - TG-P-P-030-R

Thermal Grizzly Putty Pro 30g - Pasta termoprzewodz?ca - Chlodzenie CPU - TG-P-P-030-R

TG Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences, making it ideal as a replacement for thermal pads on GPUs. Graphics cards typically feature several types of thermal pads of varying thicknesses from the factory, requiring different pads during replacement or when converting the cooler to a GPU water cooler. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for broad application, while by hand, it can be shaped into small pellets tailored to the surface size (e.g., VRAM, SMD). TG Putty can fill height differences ranging from 0.2 to 3.0 mm. TG Putty is available in three variants, primarily differing in their thermal conductivity: TG Putty Basic: Medium thermal conductivity TG Putty Advance: Good thermal conductivityTG Putty Pro: Excellent thermal conductivity Scope of Delivery Thermal Putty Pro 3x Spatulas

PLN 220.00
1

Thermal Grizzly WireView Pro GPU 1x12VHPWR Reverse - Obudowa komputerowa akcesoria - TG-WV-P-H1R

Thermal Grizzly WireView Pro GPU 1x12VHPWR Reverse - Obudowa komputerowa akcesoria - TG-WV-P-H1R

The WireView Pro GPU is an advanced version of the device for measuring and monitoring the power consumption of graphics cards. Developed in collaboration with Jon "elmor" Sandström, the WireView Pro GPU connects to the 12VHPWR power connector of the graphics card and is linked to the power supply through the power cable. Power consumption data is displayed on an OLED screen. The Pro version has been enhanced with connector detection and temperature sensors. An added buzzer provides an audible warning if the adjustable temperature or current limit is exceeded or if the cable is not correctly connected or if an incorrectly specified cable is used. The Pro version has been upgraded with connector detection, temperature sensors, and an audible warning signal. The WireView Pro GPUs connector detection identifies whether a 150-watt, 300-watt, 450-watt, or 600-watt specified cable is used. Reverse variant

PLN 396.00
1

Thermal Grizzly Putty Basic 30g - Pasta termoprzewodz?ca - Chlodzenie CPU - TG-P-B-030-R

Thermal Grizzly Putty Basic 30g - Pasta termoprzewodz?ca - Chlodzenie CPU - TG-P-B-030-R

TG Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences, making it ideal as a replacement for thermal pads on GPUs. Graphics cards typically feature several types of thermal pads of varying thicknesses from the factory, requiring different pads during replacement or when converting the cooler to a GPU water cooler. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for broad application, while by hand, it can be shaped into small pellets tailored to the surface size (e.g., VRAM, SMD). TG Putty can fill height differences ranging from 0.2 to 3.0 mm. TG Putty is available in three variants, primarily differing in their thermal conductivity:TG Putty Basic: Medium thermal conductivity TG Putty Advance: Good thermal conductivity TG Putty Pro: Excellent thermal conductivity Scope of Delivery Thermal Putty Basic 3x Spatulas

PLN 92.00
1

Thermal Grizzly Putty Advance 30g - Pasta termoprzewodz?ca - Chlodzenie CPU - TG-P-A-030-R

Thermal Grizzly Putty Advance 30g - Pasta termoprzewodz?ca - Chlodzenie CPU - TG-P-A-030-R

TG Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences, making it ideal as a replacement for thermal pads on GPUs. Graphics cards typically feature several types of thermal pads of varying thicknesses from the factory, requiring different pads during replacement or when converting the cooler to a GPU water cooler. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for broad application, while by hand, it can be shaped into small pellets tailored to the surface size (e.g., VRAM, SMD). TG Putty can fill height differences ranging from 0.2 to 3.0 mm. TG Putty is available in three variants, primarily differing in their thermal conductivity: TG Putty Basic: Medium thermal conductivityTG Putty Advance: Good thermal conductivity TG Putty Pro: Excellent thermal conductivity Scope of Delivery Thermal Putty Advanced 3x Spatulas

PLN 120.00
1

Thermal Grizzly AMD Mycro Direct-Die Pro RGB V1 - Chlodzenie CPU - TG-MY-DD-P-RGB-AMD-V1

Thermal Grizzly AMD Mycro Direct-Die Pro RGB V1 - Chlodzenie CPU - TG-MY-DD-P-RGB-AMD-V1

The AMD Mycro Direct-Die Pro RGB V1 features a hybrid structure with two different sizes of microfins and a jet plate for optimized flow. The cooler's cold plate is made of nickel-plated copper and is mounted directly on the CPU chip. For this, the Socket Actuation Mechanism (SAM) of the motherboard is removed, and the processor must be delidded. The nickel plating of the cooler plate creates a barrier layer, preventing gallium-based liquid metal from diffusing into the copper, making multiple applications of liquid metal usually unnecessary. Warranty: Installing the product may invalidate warranty of the motherboard or CPU. Note on Ryzen 9000 compatibility: The AM5 Mycro Direct-Die Pro RGB V1 is, according to internal testing, compatible with AMD's Ryzen-9000 and 9000X3D processor series (as of Nov 2024). Scope of Delivery: 1x AMD Mycro Direct-Die RGB Pro V1 1x Insulation sheet 1x pressure test report to 600 mbar 4x pan-head screws UNC thread 1/4" 1x hexagon socket wrench 5/64" 1x angle wrench Torx T20

PLN 634.00
1

Thermal Grizzly Ryzen 7000 Direct Die Frame - Chlodzenie CPU - TG-DDF-R7000-R

Thermal Grizzly Ryzen 7000 Direct Die Frame - Chlodzenie CPU - TG-DDF-R7000-R

Radiator procesorów Ryzen 7000 jest bardzo gruby, co wynika cz??ciowo z kompatybilno?ci z starszymi ch?odnicami CPU dla gniazda AM4. Niepotrzebna grubo?? radiatora zmniejsza przewodno?? ciepln?, dzi?ki czemu procesory s? u?ytkowane przy bardzo wysokich temperaturach, które wynosz? oko?o 95 stopni Celsjusza. Usuni?cie radiatora (decapitating, delidding) umo?liwia zamontowanie ch?odnicy CPU bezpo?rednio na chipletach procesora Ryzen 7000, drastycznie obni?aj?c temperatury. Aby unikn?? uszkodzenia wra?liwych uk?adów i zapobiec problemom podczas pracy (np. RAM), Ramka Direct Die Frame Ryzen 7000 zast?puje Mechanizm Aktywacji Gniazda p?yty g?ównej (SAM). ANULUJE GWARANCJ? Przy usuwaniu pokrywy radiatora anuluje si? gwarancj? - korzystanie z narz?dzia Direct Die Frame odbywa si? na w?asne ryzyko.

PLN 186.00
1