Nanoparticle Engineering for Chemical-Mechanical Planarization - Fabrication of Next-Generation Nanodevices - Bok av Ungyu Paik - Inbunden
Explains the physicochemical properties of nanoparticles according to each step in the chemical mechanical planarization (CMP) process, including dielectric CMP, shallow trend isolation CMP, metal CMP, poly isolation CMP and noble metal CMP. This work also presents design techniques using polymeric additives to improve CMP performance.